SWF-08 Lead Free Solder

Open price.
 
Wire diameter (mm): 0.8. 
Wire length (m): 4.4. 
Alloy Composition (%): Sn96.5, Ag3.0, Cu0.5. 
Flux(Wt%): 3.5%. 
Melting Point: 217℃. 
Weight (g): 14. 
Equivalent peel strength as conventional solder. 
No cleaning high performance resin core lead free solder. 
Completely non-corrosive flux residue which requires no cleaning after soldering. 
Everlasting and reliable bonding owing to non-conductive and non-absorbable residue. 
Wide solder spread and wetting for speedy work. 
Contains organic amine activated rosin to meet JIS AA & MIL-RMA. 
For use on precision PCB of copper and its alloy