SWF-08 Lead Free Solder

Open price.
 
Wire diameter (mm) : 1.0
Wire length (m) : 5.5
Alloy Composition (%) : Sn96.5, Ag3.0, Cu0.5
Flux(Wt%) : 3.5%
Melting Point : 217℃
Weight (g) : 26
Equivalent peel strength as conventional solder
No cleaning high performance resin core lead free solder
Completely non-corrosive flux residue which requires no cleaning after soldering
Everlasting and reliable bonding owing to non-conductive and non-absorbable residue
Wide solder spread and wetting for speedy work
Contains organic amine activated rosin to meet JIS AA & MIL-RMA.
For use on precision PCB of copper and its alloy